DDR3L and DDR4 — Spec to Spec
Wide-Temp DDR3L
Temperature range: -40°C to 105°C. 100% physically tested per die. Speeds from 1333 to 1866 Mbps. Capacities: 4 Gb AND 8 Gb.
Wafer processed at PSMC. Package and test by FATC. In-house tape-out; zero dependency on third-party IP roadmaps.
Wide-Temp DDR4
Temperature range: -40°C to 105°C. 100% physically tested per die. Speeds from 2133 to 3200 MT/s. Capacities: 4 Gb to 16 Gb.
Same vertically integrated supply chain as DDR3. PSMC wafer fab, FATC packaging. Fully controllable specification cadence.
Full Qualification. Both Families. Every Die.
Wide-Temp DDR3 and DDR4 — both designed in-house, taped out at Tier-1 fabs, and 100% tested across -40°C to 105°C. Specifications you control, supply chain you can audit.
Shipped unbranded. Branded on request.
Both families ship without logo by default, preserving full supply-chain flexibility. Custom OEM mark printing on wafer or package is available — your brand, our qualification envelope.