Ultimate Reliability in Extreme Environments
Wide-temp DDR3L BGA packaging and DDR4 memory qualified from -40°C to 105°C. Every die physically tested. Full design ownership, no outsourced qualification chain.
Wide-Temperature Memory Solutions
Wide-Temp DDR4
Wide-temperature DDR3L BGA packaging qualified across the full -40°C to 105°C envelope. 100% tested, PSMC wafer origin, FATC packaged.
High-bandwidth DDR4 for demanding platforms: automotive, AI server, and defense applications where temperature tolerance is non-negotiable.
Operating Range: -40°C to 105°C | Fab: PSMC | Pkg: FATC
Operating Range: -40°C to 105°C | Fab: PSMC | Pkg: FATC
Control at Every Stage
Top-Tier Supply Chain
Wafer processing by PSMC, packaging and testing by FATC. Direct fab relationships — no intermediary, no opacity.
Proven Extreme Tolerance
Custom OEM Branding
Wafer and package shipped logo-free by default. Custom brand printing available on request — your mark, your supply chain.
Independent R&D
In-house design and tape-out. Tier-1 fab manufacturing. Zero tech bottlenecks — the roadmap is ours, not a licensee's.
Uncompromising Quality
100% wide-temperature full inspection. Stringent outgoing quality control. Auditable at every step.
100% physically tested from -40°C to 105°C. Not sampled — every single die, no exceptions.
Ready to Qualify for Your BOM?
Request samples or a formal quote. Full test data available. OEM branding options confirmed at order stage.
REACH OUT
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Global OEM inquiries welcome
WhatsApp: 86 195 8414 5080 (Response within one business day)
ADD: Room 703-705, BanLi Building, LongHua, QingHu, Shenzhen, Guangdong Province, China
(C) 2024 NEXDIE INDUSTRIAL - FULL QUALIFICATION. NO COMPROMISES.
Tested every die
