MT41K512M16VRP-107 IT:P Datasheet & 8Gb DDR3L Replacement Guide

MT41K512M16VRP-107 IT:P Datasheet & 8Gb DDR3L Replacement Guide

The MT41K512M16VRP-107 IT:P is an 8Gb DDR3L SDRAM device organized as 512M ×16 and supplied in a 96-FBGA package.

For engineers working with embedded computers, industrial control systems, networking equipment, and other long-life platforms, understanding the exact specifications of an existing DRAM component is an important first step when evaluating a replacement.

This guide covers the key specifications of MT41K512M16VRP-107 IT:P, common part-number search variations, DDR3L replacement considerations, and the parameters engineers should verify before selecting an alternative device.

MT41K512M16VRP-107 IT:P Specifications

The MT41K512M16VRP-107 IT:P is an 8Gbit DDR3L SDRAM device with a 512M ×16 organization and a 96-FBGA (8 × 14 mm) package. Available component data lists a 1.283V to 1.45V supply range and an operating temperature range of -40°C to +95°C (TC).

MT41K512M16VRP-107 IT:P Part Number Search Variations

When searching for this component, engineers may encounter several variations of the same base part number.

Search engines and component databases may display the part number with different spacing, suffix formatting, or ordering-code combinations.

What Does MT41K512M16VRP-107 Mean?

The complete part number contains several identifiers that are useful when evaluating a replacement.

The MT41K512M16 portion identifies the memory density and organization, while the -107 designation identifies the speed grade.

The IT:P portion is part of the complete manufacturer ordering code and should be retained when searching for the exact component.

When sourcing or replacing a memory IC, engineers should use the complete ordering code rather than relying only on the base part number.

Why the 512M ×16 Organization Matters

The MT41K512M16VRP-107 IT:P uses a 512M ×16 organization.

This is important because two DRAM devices can have the same total density while using different organizations.

For example, an 8Gb ×8 device and an 8Gb ×16 device should not automatically be considered interchangeable.

When evaluating an MT41K512M16VRP-107 replacement, the following parameters should therefore be checked together:

• Memory density

• Organization

• DDR generation

• Speed grade

• Timing

• Voltage

• Package

• Ball configuration

• Operating temperature

This is particularly important for embedded and industrial systems where the DRAM may be soldered directly onto the PCB.

MT41K512M16VRP-107 IT:P Replacement Considerations

Finding an alternative for an existing DDR3L device is not simply a matter of finding another 8Gb memory IC.

A proper DDR3L replacement evaluation should begin with the original device's electrical and mechanical requirements.

1. Density

The original device provides 8Gb of memory density.

A replacement should provide the required capacity without changing the system's intended memory architecture.

2. Organization

The original organization is 512M ×16.

The replacement should be evaluated for equivalent memory organization and controller compatibility.

3. Speed and Timing

The -107 speed grade corresponds to a 933 MHz clock frequency and 1866 MT/s DDR data rate in the listed component specifications.

The replacement must satisfy the timing requirements of the target platform.

4. Voltage

The listed supply range is 1.283V to 1.45V.

Voltage compatibility should be checked at the system level before qualification.

5. Package

The device is listed in a 96-FBGA (8 ×14 mm) package.

Package dimensions and ball configuration should be verified before considering a replacement for an existing PCB design.

PRB8G1646D for 8Gb DDR3L Replacement Evaluation

NexDie PRB8G1646D is specified as a 512M ×16 DDRIII/DDRIIIL SDRAM. Its documentation specifies a 1.283V to 1.45V supply range and a 96-ball BGA package.

This makes PRB8G1646D relevant when evaluating 8Gb 512M ×16 DDR3L replacement and migration options.

However, an alternative component should not be described as a universal drop-in replacement solely because the density and organization match.

Before approving a replacement, engineers should verify:

• Speed grade and timing

• Voltage requirements

• Package and ball map

• Memory controller compatibility

• PCB implementation

• Operating-temperature requirements

• System-level qualification

DDR3L Replacement for Industrial and Embedded Systems

DDR3L remains relevant in many embedded platforms and long-life electronic systems.

When an original memory component becomes difficult to source, an industrial DDR3L replacement needs to satisfy more than the basic memory capacity requirement.

Engineers should evaluate:

• Electrical compatibility

• Memory organization

• Timing

• Package compatibility

• Temperature requirements

• Availability

• Long-term supply

• Qualification requirements

This is especially important for industrial computers and embedded systems that may remain in production for many years.

DDR3L EOL Replacement Considerations

An EOL replacement should ideally be evaluated before the original component becomes unavailable.

A structured replacement process can reduce the risk of an unexpected redesign:

Original DDR3L → Specification Comparison → Replacement Evaluation → Engineering Validation → Production Qualification

For long-life embedded platforms, qualifying an alternative memory source before a supply disruption can provide additional flexibility during the product lifecycle.

Related Micron DDR3L Components

The MT41K512M16VRP-107 IT:P is one member of the broader Micron DDR3L memory family.

For another Micron DDR3L device with a different memory organization, see our guide to MT41K128M16JT 125.For a 4Gb 256M × 16 option, see our guide to MT41K256M16TW 107 P

Conclusion

The MT41K512M16VRP-107 IT:P is an 8Gb DDR3L SDRAM device organized as 512M ×16, with a 96-FBGA package and a listed 1.283V to 1.45V supply range.

When evaluating an MT41K512M16VRP-107 replacement, engineers should look beyond memory density and verify organization, timing, voltage, package, temperature requirements, and system-level compatibility.

NexDie PRB8G1646D provides another 8Gb, 512M ×16 DDRIII/DDRIIIL SDRAM option for replacement and migration evaluation.