Full Qualification. Both Families. Every Die.
Wide-Temp DDR3L and DDR4 — both designed in-house, taped out at Tier-1 fabs, and 100% tested across -40°C to 105°C. Specifications you control, supply chain you can audit.
NexDie wide-temperature DDR DRAM designed for extreme 105°C environments
Wide-Temp DDR3L
Temperature range: -40°C to 105°C. 100% physically tested per die. Speeds from 1333 to 1866 Mbps. Capacities: 4 Gb AND 8 Gb.
Wafer processed at PSMC. Package and test by FATC. In-house tape-out; zero dependency on third-party IP roadmaps.
Wide-Temp DDR4
wide temperature ddr range: -40°C to 105°C. 100% physically tested per die. Speeds from 2133 to 3200 MT/s. Capacities: 4 Gb and 8 Gb.
Same vertically integrated supply chain as DDR3. PSMC wafer fab, FATC packaging. Fully controllable specification cadence.
Shipped unbranded. Branded on request.
Both families ship without logo by default, preserving full supply-chain flexibility. Custom OEM mark printing on wafer or package is available — your brand, our qualification envelope.
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Global OEM inquiries welcome
WhatsApp: 86 195 8414 5080 (Response within one business day)
ADD: Room 703-705, BanLi Building, LongHua, QingHu, Shenzhen, Guangdong Province, China
(C) 2024 NEXDIE INDUSTRIAL - FULL QUALIFICATION. NO COMPROMISES.
Tested every die
